Ceramic PCB

세라믹 기판 (Ceramic Substrate)

세라믹 기판은 소성 과정을 거친 얇고 평평한 재질로, 방열 성능과 절연 특성이 매우 우수합니다. 일반적으로 알루미나(Aluminum Oxide)나 베릴리아(Beryllium Oxide) 소재가 주로 사용됩니다.

세라믹 PCB의 특성

세라믹 PCB는 높은 운용 온도와 낮은 열팽창 계수를 가집니다. 또한 열적 특성이 뛰어나고 고주파 대역에서의 성능이 탁월하며, 수분 흡수를 방지하는 능력이 우수합니다.

지금 견적 받기
Ceramic PCB Capabilities
ItemThick FilmDCB/DBCDPCAMB
Layer Count10 Layers2 Layers2 Layers2 Layers
Max Board Dimension138*190mm138*178mm138*190mm114*114mm
Min Board Thickness0.25mm0.30mm – 0.40mm0.25mm0.25mm
Max Board Thickness2.0mm1L: 1.3mm; 2L: 1.6mm2.0mm1.8mm
Conductor Thickness5um – 13um0.10mm – 0.30mm2um – 200um0.25mm – 0.80mm
Min Line Width/Space6/8mil (0.15/0.20mm)12/12mil (0.30/0.30mm)6/8mil (0.15/0.20mm)20/20mil (0.50/0.50mm)
Substrate TypeAl2O3, AIN, BeO, ZrO2Al2O3, AIN, ZrO2Al2O3, AIN, ZrO2, Si3N4Al2O3, AIN, Si3N4
Substrate Thickness0.25, 0.38, 0.50…2.0mm0.25, 0.38, 0.50…2.0mm0.25, 0.38, 0.50…2.0mm0.25, 0.38, 0.50…1.0mm
Min Hole Diameter4mil (0.1mm)
Min Hole SpacingNPTH: 16mil (0.30mm); PTH: 20mil (0.5mm)
Min PAD Ring6mil (0.15mm)N/A3mil (0.075mm)N/A
Surface TreatmentAgPd, AgPt, AuOSP / Ni Plating / ENIG / ENEPIG
Thermal Stress1 hour @ 350℃3 x 10 Sec @ 280 ℃15 min @ 350 ℃3 x 10 Sec @ 280 ℃
Ceramic PCB Material
ItemAttribute
BrandCeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba
Base MaterialAI2O3 / AIN / BeO / SiO2
Base Material Thickness0.20mm / 0.25mm / 0.30mm / 0.38mm / 0.50mm / 0.635mm / 0.76mm / 0.80mm / 1.0 mm / 1.2 mm / 1.5mm / 2.0 mm
Thermal Conductivity24w / 27w / 170w / 200w / 240W
Soldermask TypeGlass glaze, Soldermask oil (white, black, green, blue, yellow, red)
Tg Value200 / 250 / 300 / 400 / 500 / 600 / 700 / 800
Halogen FreeYes (optional)
Breakdown Voltage11 – 34 KV
Dielectric Constant (MHZ)9 – 10
Water Absorption0%
ROHSYes
Flammability94V-0
Thermal Conductivity (W/m.K)Al2O3: ≥ 24; AIN: ≥ 170; BeO: ≥ 240; Si304: 16 – 22
Dielectric Strength0.635mm: 11KV/mm; 1.0mm: 17KV/mm; 2.0mm: 34KV/mm
Wrap & Twist≤ 0.75%
Prototype Lead Time
Prototype(<1m²)LayersNormal ServiceExpedited Service
Ceramic PCB1 LayerThick Film: 3 – 3.5 weeks
DCB/DBC/AMB: 3 – 4 weeks
DPC: 2 – 3 weeks		Thick Film: 1.5 weeks
DCB/DBC/AMB: 2 – 3 weeks
DPC: 1.5 weeks
2 LayersThick Film: 3 – 4 weeks
DCB/DBC/AMB: 3.5 – 4.5 weeks
DPC: 2.5 – 3.5 weeks		Thick Film: 2 weeks
DCB/DBC/AMB: 2.5 – 3.5 weeks
DPC: 2 weeks
4 LayersThick Film: 4 – 6 weeks2.5 weeks
6 LayersThick Film: 4.5 – 6 weeks2.5 weeks
8 LayersThick Film: 5 – 7 weeks3 weeks
10 LayersThick Film: 6 – 8 weeks3.5 – 4 weeks
Mass Production Lead Time
ProductionLayersNormal ServiceExpedited Service
Ceramic PCB1 LayerThick Film: 3.5 – 4 weeks
DCB/DBC/AMB: 4 – 5 weeks
DPC: 4 – 5 weeks		Thick Film: 1.5 – 2.5 weeks
DCB/DBC/AMB: 2.5 – 3.5 weeks
DPC: 2 – 3 weeks
2 LayersThick Film: 4.5 – 5.5 weeks
DCB/DBC/AMB: 5 – 6 weeks
DPC: 5 – 6 weeks		Thick Film: 2 – 3 weeks
DCB/DBC/AMB: 3 – 4 weeks
DPC: 2.5 – 3.5 weeks
4 LayersThick Film: 5 – 6 weeks2.5 – 3 weeks
6 LayersThick Film: 5 – 6 weeks3 – 3.5 weeks
8 LayersThick Film: 6 – 7 weeks3 – 4 weeks
10 LayersThick Film: 7 – 9 weeks4 – 5 weeks
ItemThick FilmDCB/DBCDPCAMB
Layer Count10 Layers2 Layers2 Layers2 Layers
Max Board Dimension138*190mm138*178mm138*190mm114*114mm
Min Board Thickness0.25mm0.30mm – 0.40mm0.25mm0.25mm
Max Board Thickness2.0mm1L: 1.3mm; 2L: 1.6mm2.0mm1.8mm
Conductor Thickness5um – 13um0.10mm – 0.30mm2um – 200um0.25mm – 0.80mm
Min Line Width/Space6/8mil (0.15/0.20mm)12/12mil (0.30/0.30mm)6/8mil (0.15/0.20mm)20/20mil (0.50/0.50mm)
Substrate TypeAl2O3, AIN, BeO, ZrO2Al2O3, AIN, ZrO2Al2O3, AIN, ZrO2, Si3N4Al2O3, AIN, Si3N4
Substrate Thickness0.25, 0.38, 0.50…2.0mm0.25, 0.38, 0.50…2.0mm0.25, 0.38, 0.50…2.0mm0.25, 0.38, 0.50…1.0mm
Min Hole Diameter4mil (0.1mm)
Min Hole SpacingNPTH: 16mil (0.30mm); PTH: 20mil (0.5mm)
Min PAD Ring6mil (0.15mm)N/A3mil (0.075mm)N/A
Surface TreatmentAgPd, AgPt, AuOSP / Ni Plating / ENIG / ENEPIG
Thermal Stress1 hour @ 350℃3 x 10 Sec @ 280 ℃15 min @ 350 ℃3 x 10 Sec @ 280 ℃
ItemAttribute
BrandCeramTec / GTT / Huaqing / Laird / Maruwa / Rogers / Toshiba
Base MaterialAI2O3 / AIN / BeO / SiO2
Base Material Thickness0.20mm / 0.25mm / 0.30mm / 0.38mm / 0.50mm / 0.635mm / 0.76mm / 0.80mm / 1.0 mm / 1.2 mm / 1.5mm / 2.0 mm
Thermal Conductivity24w / 27w / 170w / 200w / 240W
Soldermask TypeGlass glaze, Soldermask oil (white, black, green, blue, yellow, red)
Tg Value200 / 250 / 300 / 400 / 500 / 600 / 700 / 800
Halogen FreeYes (optional)
Breakdown Voltage11 – 34 KV
Dielectric Constant (MHZ)9 – 10
Water Absorption0%
ROHSYes
Flammability94V-0
Thermal Conductivity (W/m.K)Al2O3: ≥ 24; AIN: ≥ 170; BeO: ≥ 240; Si304: 16 – 22
Dielectric Strength0.635mm: 11KV/mm; 1.0mm: 17KV/mm; 2.0mm: 34KV/mm
Wrap & Twist≤ 0.75%
Prototype(<1m²)LayersNormal ServiceExpedited Service
Ceramic PCB1 LayerThick Film: 3 – 3.5 weeks
DCB/DBC/AMB: 3 – 4 weeks
DPC: 2 – 3 weeks		Thick Film: 1.5 weeks
DCB/DBC/AMB: 2 – 3 weeks
DPC: 1.5 weeks
2 LayersThick Film: 3 – 4 weeks
DCB/DBC/AMB: 3.5 – 4.5 weeks
DPC: 2.5 – 3.5 weeks		Thick Film: 2 weeks
DCB/DBC/AMB: 2.5 – 3.5 weeks
DPC: 2 weeks
4 LayersThick Film: 4 – 6 weeks2.5 weeks
6 LayersThick Film: 4.5 – 6 weeks2.5 weeks
8 LayersThick Film: 5 – 7 weeks3 weeks
10 LayersThick Film: 6 – 8 weeks3.5 – 4 weeks
Production Layers Normal Service Expedited Service
Ceramic PCB 1 Layer Thick Film: 3.5 – 4 weeks DCB/DBC/AMB: 4 – 5 weeks DPC: 4 – 5 weeks Thick Film: 1.5 – 2.5 weeks DCB/DBC/AMB: 2.5 – 3.5 weeks DPC: 2 – 3 weeks
2 Layers Thick Film: 4.5 – 5.5 weeks DCB/DBC/AMB: 5 – 6 weeks DPC: 5 – 6 weeks Thick Film: 2 – 3 weeks DCB/DBC/AMB: 3 – 4 weeks DPC: 2.5 – 3.5 weeks
4 Layers Thick Film: 5 – 6 weeks 2.5 – 3 weeks
6 Layers Thick Film: 5 – 6 weeks 3 – 3.5 weeks
8 Layers Thick Film: 6 – 7 weeks 3 – 4 weeks
10 Layers Thick Film: 7 – 9 weeks 4 – 5 weeks

적용 사례

경쟁사보다 앞서 나갈 수 있도록, 풍부한 현장 노하우로 지원하겠습니다.

FR4 PCB for Intelligent tracking series products

  • Layer Count: 4 Layers
  • PCB Type: FR4 PCB
  • Material: FR4 PCB TG150
  • Board Thickness: 1.6mm +/-10%
  • Copper Thickness: 1oz
  • Surface Treatment: ENIG(Au 1u‘’)
  • Solder Mask: Green

Extra thin PCB for health monitoring devices

  • Layer Count: 2 Layers
  • PCB Type: FR4 PCB
  • Material: FR4 PCB TG180
  • Board Thickness: 0.15mm
  • Copper Thickness: 1oz
  • Surface Treatment: ENEPIG(Au 1u‘’)
  • Solder Mask: Black

Heavy copper PCB for electric vehicle charging

  • Layer Count: 6 Layers
  • PCB Type: Heavy Copper PCB
  • Material: FR4 PCB TG170
  • Board Thickness: 2.0mm +/-10%
  • Copper Thickness: 6/6/6/6/6/6oz
  • Surface Treatment: ENIG(Au 1u‘’)
  • Solder Mask: Green