Flexible PCB
플렉시블(Flexible) PCB는 구부릴 수 있는 특성을 가진 인쇄회로기판입니다. 대부분 폴리이미드(PI) 필름이나 폴리에스터 필름으로 제작됩니다.
여러 응용 분야에서 플렉시블 PCB를 사용하면 커넥터와 케이블을 줄일 수 있어 비용을 절감하고, 연결 신뢰성을 높이며 조립 시간과 비용, 장치 전체 크기를 줄이는 데 도움을 줍니다.
Flexible PCB Capabilities
| Item | Capabilities |
|---|---|
| Layer Count | 1 – 30 Layers |
| Max Board Dimension | 1L: 500*2000mm; 2L: 250*1380mm |
| Min Board Thickness | 0.05mm |
| Max Board Thickness | 3.0mm |
| Conductor Thickness | 1/3 OZ(12 um) – 4OZ(140um) |
| Min Line Width/Line Space | 2/2mil (0.05/0.05mm) |
| Min Hole Diameter | 4mil (0.10mm) |
| Min Hole Spacing | NPTH: 16mil (0.4mm); PTH: 20mil (0.5mm) |
| Min PAD Ring(Single) | 3mil (0.075mm) |
| PTH Wall Thickness | 0.59mil (15um) |
| Min Solder PAD Dia | 10mil (0.25mm) |
| Min Soldermask Bridge | 12mil (0.30mm) |
| Min BGA PAD Margin | 12mil (0.30mm) |
| PTH/NPTH Dia Tolerance | PTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm) |
| Hole Position Deviation | ±4mil (0.10mm) |
| Outline Tolerance | Laser: +0.15mm / -0.05mm; Die Punch: +0.10 / -0.20 mm |
| Max Aspect Ratio | 8:1 |
| Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG |
| Impedance Controlled | Value > 50ohm: ±10%; Value ≤ 50ohm: ±5 ohm |
Flexible PCB Material
| Item | Attribute |
|---|---|
| Brand | Dupont / Doosan / Grace / Panasonic / SYL / Tailfex / ThinFlex / Ventec |
| Base Material | Polyimide / PET |
| Base Material Thickness | 12um / 18um / 25um / 50um / 75um / 100um / 125um / 150um |
| Coverlay Type | Polyimide (yellow, white, black, clear), PET; Soldermask oil (green, blue, black, white, yellow, red, clear) |
| Tg Value | 130 / 150 |
| Halogen Free | Yes |
| ROHS | Yes |
| Flammability | 94V-0 |
| Dielectric Strength | ≥ 1.35 KV/mm |
| Wrap & Twist | ≤ 1% |
Prototype Lead Time
| Prototype(<1m²) | Layers | Normal Service | Expedited Service |
|---|---|---|---|
| Flexible PCB | 1 Layer | 0.5 – 1 week | 48 hours |
| 2 Layers | 0.5 – 1 week | 48 hours | |
| 3 Layers | 1.5 – 2 weeks | 72 hours | |
| 4 Layers | 2.5 – 3 weeks | 96 hours | |
| 6 Layers | 3 – 4 weeks | 120 hours | |
| 8 – 12 Layers | 4 – 5 weeks | 144 hours |
Mass Production Lead Time
| Mass Production | Layers | Normal Service | Expedited Service |
|---|---|---|---|
| Flexible PCB | 1 Layer | 1.5 – 2 weeks | 1 week |
| 2 Layers | 2 – 2.5 weeks | 1 week | |
| 3 Layers | 2.5 – 3 weeks | 1.5 weeks | |
| 4 Layers | 3 – 4 weeks | 1.5 weeks | |
| 6 Layers | 4 – 5 weeks | 1.5 – 2 weeks | |
| 8 – 12 Layers | 5 – 7 weeks | 2 – 3 weeks |
- Flexible PCB Capabilities
- Flexible PCB Material
- Prototype Lead Time
- Mass Production Lead Time
| Item | Capabilities |
|---|---|
| Layer Count | 1 – 30 Layers |
| Max Board Dimension | 1L: 500*2000mm; 2L: 250*1380mm |
| Min Board Thickness | 0.05mm |
| Max Board Thickness | 3.0mm |
| Conductor Thickness | 1/3 OZ(12 um) – 4OZ(140um) |
| Min Line Width/Line Space | 2/2mil (0.05/0.05mm) |
| Min Hole Diameter | 4mil (0.10mm) |
| Min Hole Spacing | NPTH: 16mil (0.4mm); PTH: 20mil (0.5mm) |
| Min PAD Ring(Single) | 3mil (0.075mm) |
| PTH Wall Thickness | 0.59mil (15um) |
| Min Solder PAD Dia | 10mil (0.25mm) |
| Min Soldermask Bridge | 12mil (0.30mm) |
| Min BGA PAD Margin | 12mil (0.30mm) |
| PTH/NPTH Dia Tolerance | PTH: ±3mil (0.075mm); NPTH: ±2mil (0.05mm) |
| Hole Position Deviation | ±4mil (0.10mm) |
| Outline Tolerance | Laser: +0.15mm / -0.05mm; Die Punch: +0.10 / -0.20 mm |
| Max Aspect Ratio | 8:1 |
| Surface Treatment | ENIG, Flash Gold, Hard Gold Finger, Gold Plating(50mil), Gold Finger, Selected Gold Plating, ENEPIG, ENIPIG |
| Impedance Controlled | Value > 50ohm: ±10%; Value ≤ 50ohm: ±5 ohm |
| Item | Attribute |
|---|---|
| Brand | Dupont / Doosan / Grace / Panasonic / SYL / Tailfex / ThinFlex / Ventec |
| Base Material | Polyimide / PET |
| Base Material Thickness | 12um / 18um / 25um / 50um / 75um / 100um / 125um / 150um |
| Coverlay Type | Polyimide (yellow, white, black, clear), PET; Soldermask oil (green, blue, black, white, yellow, red, clear) |
| Tg Value | 130 / 150 |
| Halogen Free | Yes |
| ROHS | Yes |
| Flammability | 94V-0 |
| Dielectric Strength | ≥ 1.35 KV/mm |
| Wrap & Twist | ≤ 1% |
| Prototype(<1m²) | Layers | Normal Service | Expedited Service |
|---|---|---|---|
| Flexible PCB | 1 Layer | 0.5 – 1 week | 48 hours |
| 2 Layers | 0.5 – 1 week | 48 hours | |
| 3 Layers | 1.5 – 2 weeks | 72 hours | |
| 4 Layers | 2.5 – 3 weeks | 96 hours | |
| 6 Layers | 3 – 4 weeks | 120 hours | |
| 8 – 12 Layers | 4 – 5 weeks | 144 hours |
| Mass Production | Layers | Normal Service | Expedited Service |
|---|---|---|---|
| Flexible PCB | 1 Layer | 1.5 – 2 weeks | 1 week |
| 2 Layers | 2 – 2.5 weeks | 1 week | |
| 3 Layers | 2.5 – 3 weeks | 1.5 weeks | |
| 4 Layers | 3 – 4 weeks | 1.5 weeks | |
| 6 Layers | 4 – 5 weeks | 1.5 – 2 weeks | |
| 8 – 12 Layers | 5 – 7 weeks | 2 – 3 weeks |
적용사례
연성회로기판(FPCB)은 뛰어난 유연성과 신뢰성을 바탕으로 LED 조명, 통신 기기, 자동차 전장, 의료 기기 등 다양한 산업 분야에서 널리 사용되고 있습니다.
자동차 전장용 FPCB
- Layer Count: 4 Layers
- PCB Type: Flexible PCB
- Board Thickness: 0.26mm +/-0.03mm
- Copper Thickness : 18um
- Surface Treatment: ENIG1u”
- Solder Mask: Yellow Coverly With Orange
의료기기용 FPCB
- Layer Count: 2 Layers
- PCB Type: Flexible PCB
- Board Thickness: 0.13mm +/-0.03mm
- Copper Thickness : 18um
- Surface Treatment: ENIG3u”
가전 및 일반 전자제품용 FPCB
- Layer Count: 4 Layers
- PCB Type: Flexible PCB
- Board Thickness: 0.25mm +/-0.03mm
- Copper Thickness : 18um
- Surface Treatment: Gold Plated 20u”